Our full turnkey service provides the hassle-free operation from wafer out, through wafer sorting, grinding, packaging and finally deliver packaged units to your end-customers. Our wide range of specialty backend service includes:
- Wafer Probing and IC Testing
- Discrete Schottky Diode and MOSFET Testing
- Test Program Development and Conversion
- DUT/Probe Card Assembly and Repairing
- Proprietary Tester Development and Manufacturing
- IC Burn-in and Reliability Test
- Wafer Back Grinding and Back Metal (BGBM)
- Chip-on-Board (COB), Die Bonding, Wire Bonding, and Packaging
- MPW wafer manual probing and characterization